| 當前位置：首頁(yè)->方案設計 |
|
| FSBB30CH60D 3kW三相馬達逆變器參考設計 |
|
|
| 文章來(lái)源： 更新時(shí)間：2015/4/24 11:21:00 |
在線(xiàn)咨詢(xún)： |
| |
Fairchild公司的FSBB30CH60D是Motion SPM® 3模塊,提供交流馬達,BLDC和PMSM馬達的全特性高性能逆變器輸出級.模塊集成了內置IGBT優(yōu)化了的柵極驅動(dòng),以降低EMI和損耗,同時(shí)提供多種保護特性,包括欠壓鎖住,過(guò)流關(guān)斷,驅動(dòng)IC的熱監測和故障報告.主要用于家用電器和工業(yè)馬達驅動(dòng).本文介紹了FSBB30CH60D主要特性,框圖,典型應用電路,以及3kW/220VAc和30A/600V 3相IGBT逆變器參考計的主要特性和指標,設計框圖,電路圖和PCB布局圖.
FSBB30CH60D is an advanced Motion SPM® 3 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, over-current shutdown, thermal monitoring of drive IC, and fault reporting. The built-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module’s internal IGBTs.
Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms.
FSBB30CH60D主要特性:
• UL Certified No. E209204 (UL1557)
• 600 V - 30 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection
• Low-Loss, Short-Circuit Rated IGBTs
• Very Low Thermal Resistance Using Al2O3 DBCSubstrate
• Built-In Bootstrap Diodes and Dedicated Vs PinsSimplify PCB Layout
• Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing
• Single-Grounded Power Supply
• LVIC Temperature-Sensing Built-In for Temperature Monitoring
• Isolation Rating: 2500 Vrms/1 min.
FSBB30CH60D應用:
• Motion Control - Home Appliance/Industrial Motor
圖1. FSBB30CH60D內部框圖
圖2. FSBB30CH60D典型應用電路
SPM3 FSBB30CH60D馬達驅動(dòng)參考設計
The SPM3 design objective is to provide a minimized package and a low power consumption module with improved reliability. This is achieved by applying new gate-driving high-voltage integrated circuit (HVIC), a new insulated-gate bipolar transistor (IGBT) of advanced silicon technology, and improved direct bonded copper (DBC) substrate base transfer mold package. Motion SPM 3 achieves reduced board size and improved reliability compared to existing discrete solutions. Target applications are inverterized motor drives for industrial use, such as air conditioners, general-purpose inverters and serve motors.
The temperature sensing function of SPM3 version 5 products is implemented in the LVIC to enhance the system reliability. An analog voltage proportional to the temperature of the LVIC is provided for monitoring the module temperature and necessary protections against over-temperature situations. Figure 1 show the package outline structure.
SPM3 FSBB30CH60D馬達驅動(dòng)參考設計主要特性:
600 V 15 A / 20 A / 30 A 3-Phase IGBT Inverter Including Control ICs for Gate Driving and Protections
Very Low Thermal Resistance by Adopting DBC Substrate
Easy PCB Layout due to Built-in Bootstrap Diodes
Divided Negative DC-Link Terminals for Inverter Three-Leg Current Sensing
Single-Grounded Power Supply due to Built-in HVICs and Bootstrap Operations
Built-in Temperature Sensing Unit of IC
Isolation Rating of 2500 VRMS/min
SPM3 FSBB30CH60D馬達驅動(dòng)參考設計主要指標:
圖3.SPM3 FSBB30CH60D馬達驅動(dòng)參考設計框圖
圖4.SPM3 FSBB30CH60D馬達驅動(dòng)參考設計三相逆變器電路圖
圖5.Motion SPM3通用應用電路
圖6.SPM3 FSBB30CH60D馬達驅動(dòng)參考設計PCB布局圖 |
| |
|
|
|
|
|
| |
|
| |
|
|
